Smartrac Launches High-Security PRELAM® based on NXP’s MIFARE DESFire® EV2 Chip Family
Amsterdam (The Netherlands), March 2, 2016 – Smartrac has announced the launch of a new PRELAM® product based on NXP’s MIFARE DESFire® EV2 chip family. The new inlay is compliant with all relevant ISO standards and ideally suited for cards and other form factors. The pre-laminate comes with a typical read/write distance of up to 10 cm (4 inches) and was designed for public transport, access control, payment and loyalty applications.
Utilizing Smartrac’s patented wire-embedding antenna technology, the latest PRELAM product combines all the benefits the MIFARE DESFire EV2 chip has to offer. This applies particularly to the IC’s benchmark security features, its inherent durability, and enhanced electrical performance in combination with superior antenna and interconnection technology of Smartrac. The chip enables selectable cryptographic methods including single DES, 2KTDES, 3KTDES and AES128, offering 2K, 4K and 8K EEPROM size and full MIFARE DESFire® EV1 backward compatibility. Furthermore, the IC offers improved multi-application features with MIsmartApp, enabling enhanced key management, and thus new business models through the seamless integration of additional services.
As a solution meeting EAL 5+ security requirements for both hardware and software, MIFARE DESFire EV2 is the best choice for customers seeking to migrate from MIFARE DESFire EV1 or compatible products to the highest security level at the lowest cost”, says Christian Lackner, Business Segment Manager for Smart Mobility, NXP Semiconductors. “At the same time MIFARE DESFire EV2 allows a truly convenient contactless experience through increased operating distance compared to previous versions.”
“Smartrac has been a MIFARE Premium Partner for many years, and we are dedicated to meet the highest quality and security standards with our PRELAM products, with millions of inlays manufactured based on MIFARE products. Our new PRELAMs based on MIFARE DESFire EV2 will enable us to serve multiple applications around the globe and to jointly drive NXP’s and Smartrac’s success in the future”, says Sebastian Gallschuetz, Vice President Product Management, Secure ID & Transactions Business Division at Smartrac Technology Group.
The new Smartrac PRELAM inlays based on NXP’s MIFARE DESFire EV2 can be ordered in PVC, PETG or PC materials and are available in high-volume quantities from today.
Smartrac is the world’s leading developer, manufacturer and supplier of RFID products and services, providing both ready-made and customized products and services suitable for a large number of applications. Smartrac makes products smart, and enables businesses to identify, authenticate, track and complement product offerings.
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